PackageXQFN
MountingSurface Mount
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Technical Specifications
NXP NTS0103GU10,115 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
XQFN
Lead Shape
No Lead
Pin Count
10
PCB
10
Package Length (mm)
1.8
Package Width (mm)
1.4
Package Height (mm)
0.45(Max)
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-288X1DDE
Logic Function
Voltage Level Translator
Output Type
3-State|Open Drain
Maximum Low Level Output Current
0.02mA
Maximum High Level Output Current
-0.02mA
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP NTS0103GU10,115 Datasheet
Download the complete datasheet for NXP NTS0103GU10,115 to view detailed technical specifications.
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