PackageXQFN EP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
NXP NX3L2267GM technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
XQFN EP
Lead Shape
No Lead
Pin Count
10
PCB
10
Package Length (mm)
2
Package Width (mm)
1.55
Package Height (mm)
0.45(Max)
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.58
Package Material
Plastic
Mounting
Surface Mount
Type
Analog Switch
Configuration
Dual SPDT
Number of Channels per Chip
2
Switch Architecture
SPDT
Number of Inputs per Chip
2
Number of Outputs per Chip
4
Polarity
Non-Inverting
Maximum On Resistance Range
1 to 5Ohm
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP NX3L2267GM Datasheet
Download the complete datasheet for NXP NX3L2267GM to view detailed technical specifications.
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