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Technical Specifications
NXP P82B96PN-112 technical specifications.
General
Package/Case
DIP
Interface
I2C, SMBus
Lead Free
Lead Free
Logic Function
Buffer
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
300mW
Max Supply Voltage
15V
Min Supply Voltage
2V
Mount
Through Hole
Number of Input Lines
4
Number of Output Lines
2
Operating Supply Current
900uA
Package Quantity
50
Packaging
Rail/Tube
Propagation Delay
90ns
Radiation Hardening
No
Reach SVHC Compliant
No
Compliance
RoHS
Compliant
Datasheet
NXP P82B96PN-112 Datasheet
Download the complete datasheet for NXP P82B96PN-112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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