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Technical Specifications
NXP P82B96TD/S910,118 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 5(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AA |
| Input Signal Type | I2C |
| Max Operating Supply Voltage | 15V |
| Type | Buffer |
| Min Operating Supply Voltage | 2V |
| Typical Operating Supply Voltage | 2.5|3.3|5|9|12V |
| Typical Input Capacitance | 7(Max)pF |
| Maximum Clock Frequency | 400kHz |
| Maximum Supply Current | 2.5mA |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP P82B96TD/S910,118 Datasheet
Download the complete datasheet for NXP P82B96TD/S910,118 to view detailed technical specifications.
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