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Technical Specifications
NXP P89LPC9311FDH,129 technical specifications.
General
Package/Case
TSSOP
Core Architecture
8051
Data Bus Width
8b
Interface
I2C, SPI, UART, USART
Max Frequency
18MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
1.5W
Memory Size
8KB
Memory Type
FLASH,
Number of I/Os
26
Number of Programmable I/O
26
Number of Timers/Counters
2
Oscillator Type
External
Package Quantity
51
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Radiation Hardening
No
RAM Size
256B
Series
LPC900
Compliance
RoHS
Not CompliantNo
Datasheet
NXP P89LPC9311FDH,129 Datasheet
Download the complete datasheet for NXP P89LPC9311FDH,129 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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