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Technical Specifications
NXP P89LPC970FDH,129 technical specifications.
General
Package/Case
TSSOP
Core Architecture
8051
Data Bus Width
8b
Interface
I2C, SPI, UART, USART
Max Frequency
18MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
5.5V
Memory Size
2KB
Memory Type
FLASH,
Min Supply Voltage
2.4V
Number of I/Os
18
Number of Programmable I/O
15
Number of Timers/Counters
5
Oscillator Type
Internal
Package Quantity
75
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
RAM Size
256B
RoHS Compliant
Yes
Series
LPC900
Compliance
RoHS
Compliant
Datasheet
NXP P89LPC970FDH,129 Datasheet
Download the complete datasheet for NXP P89LPC970FDH,129 to view detailed technical specifications.
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