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Technical Specifications
NXP PC9S12KG128MPVE technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 112 |
| PCB | 112 |
| Package Length (mm) | 20 |
| Package Width (mm) | 20 |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 1.2783 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFA |
| Family Name | HCS12 |
| Data Bus Width | 16bit |
| Instruction Set Architecture | CISC |
| Program Memory Type | Flash |
| Programmability | Yes |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP PC9S12KG128MPVE Datasheet
Download the complete datasheet for NXP PC9S12KG128MPVE to view detailed technical specifications.
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