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NXP PCA2000CX8/5/1, 025 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.16 |
| Package Width (mm) | 0.86 |
| Package Height (mm) | 0.2 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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