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Technical Specifications
NXP PCA2000CX8/5/1, 025 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
8
PCB
8
Package Length (mm)
1.16
Package Width (mm)
0.86
Package Height (mm)
0.2
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCA2000CX8/5/1, 025 Datasheet
Download the complete datasheet for NXP PCA2000CX8/5/1, 025 to view detailed technical specifications.
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