PackageHVSON EP
MountingSurface Mount
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Technical Specifications
NXP PCA2002TK/1,118 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
HVSON EP
Package Description
Heat Sinked Very Thin Small Outline No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
10
PCB
10
Package Length (mm)
3.1(Max)
Package Width (mm)
3.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCA2002TK/1,118 Datasheet
Download the complete datasheet for NXP PCA2002TK/1,118 to view detailed technical specifications.
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