PackageBare Die
MountingSurface Mount
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Technical Specifications
NXP PCA85133U/2DA/Q1 technical specifications.
General
Package Family Name
Die
Package/Case
Bare Die
Pin Count
110
PCB
110
Package Length (mm)
4.16
Package Width (mm)
1.07
Package Height (mm)
0.39
Seated Plane Height (mm)
0.4
Pin Pitch (mm)
0.05
Mounting
Surface Mount
Number of Digits
40
Number of Segments
320
Maximum Clock Frequency
0.4MHz
Min Operating Temperature
-40°C
Max Operating Temperature
95°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
400mW
Interface Type
Serial (I2C)
Maximum Supply Current
0.02mA
Min Operating Supply Voltage
1.8V
Typical Operating Supply Voltage
2.5|3.3V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCA85133U/2DA/Q1 Datasheet
Download the complete datasheet for NXP PCA85133U/2DA/Q1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.