Capacitive proximity sensor, current sinking output, operating from 3V to 9VDC. Features a 16-pin TSSOP package with gull-wing leads for surface mounting, measuring 5.1mm x 4.5mm x 0.95mm. Designed for automotive applications with a pin pitch of 0.65mm and a seated plane height of 1.1mm. Operates across a temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP PCA8886TS/Q900/1,1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5.1(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153
Module/IC Classification
IC
Type
Capacitive
Output Type
Current Sinking
Max Operating Supply Voltage
9V
DC Supply Voltage
3 to 9V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Terminal Type
Cable
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCA8886TS/Q900/1,1 Datasheet
Download the complete datasheet for NXP PCA8886TS/Q900/1,1 to view detailed technical specifications.
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