PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP PCA9665BS,118 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
20
PCB
20
Package Length (mm)
5.1(Max)
Package Width (mm)
5.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Typical Operating Supply Voltage
2.5|3.3V
Function
Parallel Bus to I2C Bus Controller
Maximum Supply Current
3mA
Interface Type
I2C
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
2.3V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCA9665BS,118 Datasheet
Download the complete datasheet for NXP PCA9665BS,118 to view detailed technical specifications.
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