Automotive LED driver IC featuring 28 gull-wing leads in a Heat Sinked Thin Shrink Small Outline Package (HTSSOP EP) with an exposed pad. Surface mountable with a 0.65mm pin pitch, this component operates from 3V to 5.5V supply voltage, supporting typical operation at 3.3V or 5V. Delivers a maximum output current of 62 mA, with a minimum low-level output current of 30000 uA. Designed for automotive applications, it functions within an operating temperature range of -40°C to 85°C.
PackageHTSSOP EP
MountingSurface Mount
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Technical Specifications
NXP PCA9952TW/Q900,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
HTSSOP EP
Package Description
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
9.7
Package Width (mm)
4.4
Package Height (mm)
0.9
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153
Low Level Output Current
30000(Min)uA
Maximum Output Current
62mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
3200mW
Maximum Supply Current
15000uA
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCA9952TW/Q900,118 Datasheet
Download the complete datasheet for NXP PCA9952TW/Q900,118 to view detailed technical specifications.
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