The PCF8811MU/2DA/1,02 is a die-formed IC from NXP, operating within a temperature range of -40°C to 85°C. It can handle a maximum power dissipation of 300mW and a maximum supply current of 50mA. The device is designed to function within a supply voltage range of 1.7V to 3.3V. It is RoHS compliant and available in a waffle packaging format, with 2640 units per package.
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| Package/Case | DIE |
| Frequency | 9MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 300mW |
| Max Supply Current | 50mA |
| Max Supply Voltage | 3.3V |
| Min Supply Voltage | 1.7V |
| Package Quantity | 2640 |
| Packaging | Waffle |
| Power Dissipation | 300mW |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 50mA |
| RoHS | Compliant |
Download the complete datasheet for NXP PCF8811MU/2DA/1,02 to view detailed technical specifications.
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