Frequency9MHz
PackageDIE
Current50mA
Power300mW
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Technical Specifications
NXP PCF8811MU/2DA/1,02 technical specifications.
General
Package/Case
DIE
Frequency
9MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
300mW
Max Supply Current
50mA
Max Supply Voltage
3.3V
Min Supply Voltage
1.7V
Package Quantity
2640
Packaging
Waffle
Power Dissipation
300mW
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
50mA
Compliance
RoHS
Compliant
Datasheet
NXP PCF8811MU/2DA/1,02 Datasheet
Download the complete datasheet for NXP PCF8811MU/2DA/1,02 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.