Applications Processor, System on Chip (SoC) featuring an ARM Cortex A8 core operating at up to 800 MHz. This 32-bit device utilizes a 0.06um process technology and offers 128KB of RAM. Packaged in a 529-Pin BGA (19x19mm) with 0.8mm pitch, it supports surface mounting and includes interfaces for Ethernet (MII, 10/100Mbps), I2C (3), SPI (3), UART (4), and USB (4). Operating voltage is typically 1.1V, with a maximum of 1.15V, and it functions within a -20°C to 85°C temperature range.
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NXP PCIMX515DJM8C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 529 |
| PCB | 529 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.12 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | i.MX51 |
| Device Core | ARM Cortex A8 |
| Maximum Clock Rate | 800MHz |
| Program Memory Type | ROMLess |
| Data Bus Width | 32bit |
| Maximum Speed | 800MHz |
| Process Technology | 0.06um |
| RAM Size | 128KB |
| Type | Applications Processor |
| Processing Unit | Microprocessor |
| Max Operating Supply Voltage | 1.15V |
| Typical Operating Supply Voltage | 1.1V |
| Application | Netbooks/Nettops/Mobile Internet Devices |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 85°C |
| Interface Type | Ethernet/I2C/SPI/UART/USB |
| SPI | 3 |
| I2C | 3 |
| I2S | 1 |
| UART | 4 |
| USB | 4 |
| USART | 0 |
| CAN | 0 |
| Ethernet | 1 |
| Number of Timers | 3 |
| Programmability | No |
| Core Architecture | ARM |
| Ethernet Interface Type | MII |
| Ethernet Speed | 10Mbps/100Mbps |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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