PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP PCK12429BD,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BBA
Number of Outputs per Chip
1
Input Logic Level
Crystal
Clock Input Frequency
10 to 20MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCK12429BD,118 Datasheet
Download the complete datasheet for NXP PCK12429BD,118 to view detailed technical specifications.
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