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Technical Specifications
NXP PCK12429BD,157 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 7 |
| Package Width (mm) | 7 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BBA |
| Number of Outputs per Chip | 1 |
| Input Logic Level | Crystal |
| Clock Input Frequency | 10 to 20MHz |
| Min Operating Supply Voltage | 3.135V |
| Max Operating Supply Voltage | 3.465V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP PCK12429BD,157 Datasheet
Download the complete datasheet for NXP PCK12429BD,157 to view detailed technical specifications.
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