The PCK2002MPW,112 is a 28-pin TSSOP lead-frame SMT fanout buffer IC with a maximum operating temperature of 70°C and a minimum operating temperature of 0°C. It has a maximum operating supply voltage of 3.465V and a minimum operating supply voltage of 3.135V. The IC is designed for surface mount applications and has a package material of plastic with a maximum package length of 9.8mm, maximum package width of 4.5mm, and a maximum package height of 0.95mm. It meets the JEDEC MO-153AE standard.
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NXP PCK2002MPW,112 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 9.8(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AE |
| Type | Fanout Buffer |
| Number of Outputs per Chip | 10 |
| Maximum Input Frequency | 133MHz |
| Min Operating Supply Voltage | 3.135V |
| Max Operating Supply Voltage | 3.465V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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