PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP PCK2002MPW,112 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
9.8(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AE
Type
Fanout Buffer
Number of Outputs per Chip
10
Maximum Input Frequency
133MHz
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCK2002MPW,112 Datasheet
Download the complete datasheet for NXP PCK2002MPW,112 to view detailed technical specifications.
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