PackageSSOP
MountingSurface Mount
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Technical Specifications
NXP PCK2014ADL,512 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
18.55(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.35(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-118AB
Number of Outputs per Chip
19
Clock Input Frequency
14.31818(Typ)MHz
Min Operating Supply Voltage
2.375/3.135V
Max Operating Supply Voltage
2.625/3.465V
Maximum Power Dissipation
850mW
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCK2014ADL,512 Datasheet
Download the complete datasheet for NXP PCK2014ADL,512 to view detailed technical specifications.
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