PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP PCK2111BD,157 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BBA
Type
Fanout Buffer
Number of Outputs per Chip
10
Maximum Input Frequency
800(Typ)MHz
Min Operating Supply Voltage
2.375V
Max Operating Supply Voltage
2.625V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCK2111BD,157 Datasheet
Download the complete datasheet for NXP PCK2111BD,157 to view detailed technical specifications.
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