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Technical Specifications
NXP PDZ33B115 technical specifications.
General
| Frequency | 30MHz |
| Impedance | 40R |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 400mW |
| Max Reverse Current | 50nA |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Number of Gates | 1 |
| Package Quantity | 3000 |
| Packaging | Cut Tape |
| Power Dissipation | 400mW |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Termination | SMD/SMT |
| Tolerance | 2% |
| Working Voltage | 33V |
| Zener Voltage | 33V |
Compliance
| RoHS | Compliant |
Datasheet
NXP PDZ33B115 Datasheet
Download the complete datasheet for NXP PDZ33B115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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