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Technical Specifications
NXP PHB160NQ08T,118 technical specifications.
General
| Package/Case | TO-263-3 |
| Continuous Drain Current (ID) | 75A |
| Drain to Source Breakdown Voltage | 75V |
| Drain to Source Resistance | 5.6mR |
| Drain to Source Voltage (Vdss) | 75V |
| Fall Time | 48ns |
| Gate to Source Voltage (Vgs) | 20V |
| Input Capacitance | 5.585nF |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 300W |
| Mount | Surface Mount |
| Package Quantity | 800 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Power Dissipation | 300W |
| Rds On Max | 5.6mR |
| RoHS Compliant | Yes |
| Series | TrenchMOS™ |
| Turn-Off Delay Time | 128ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP PHB160NQ08T,118 Datasheet
Download the complete datasheet for NXP PHB160NQ08T,118 to view detailed technical specifications.
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