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Technical Specifications
NXP PNX8526EH/M0/G technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | HBGA |
| Package Description | High Performance Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 456 |
| PCB | 456 |
| Package Length (mm) | 35.2(Max) |
| Package Width (mm) | 35.2(Max) |
| Package Height (mm) | 1.85(Max) |
| Seated Plane Height (mm) | 2.55(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP PNX8526EH/M0/G Datasheet
Download the complete datasheet for NXP PNX8526EH/M0/G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.