PackageHBGA
MountingSurface Mount
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Technical Specifications
NXP PNX8526EH/M0/G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
HBGA
Package Description
High Performance Ball Grid Array
Lead Shape
Ball
Pin Count
456
PCB
456
Package Length (mm)
35.2(Max)
Package Width (mm)
35.2(Max)
Package Height (mm)
1.85(Max)
Seated Plane Height (mm)
2.55(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP PNX8526EH/M0/G Datasheet
Download the complete datasheet for NXP PNX8526EH/M0/G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.