32-bit RISC microprocessor, PowerQUICC III MPC85xx family, featuring a single e500 core operating at up to 1000 MHz. This surface-mount device utilizes a 0.09um process technology and offers 32KB instruction and 32KB data cache. Connectivity includes multiple Ethernet interfaces (MII/RMII/RGMII/SGMII) supporting 10/100/1000Mbps, along with I2C, SPI, UART, and USB interfaces. Packaged in a 783-pin FCBGA with dimensions of 29x29x2.2mm, it operates from 0°C to 105°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
NXP PPC8536EDVTAQG technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
783
PCB
783
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
2.2(Max)
Seated Plane Height (mm)
2.76(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
PowerQUICC III MPC85xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
e500
Maximum Speed
1000MHz
Process Technology
0.09um
Core Architecture
e500
Number of CPU Cores
1
Interface Type
Ethernet/I2C/SPI/UART/USB
CAN
0
UART
2
USART
0
I2C
2
SPI
1
USB
3
Ethernet
2
I2S
0
Max Operating Supply Voltage
1.05|1.155V
Min Operating Temperature
0°C
Max Operating Temperature
105°C
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Ethernet Interface Type
MII/RMII/RGMII/SGMII
Ethernet Speed
10Mbps/100Mbps/1000Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PPC8536EDVTAQG Datasheet
Download the complete datasheet for NXP PPC8536EDVTAQG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.