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Technical Specifications
NXP PTN3460BS/F2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
56
PCB
56
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PTN3460BS/F2 Datasheet
Download the complete datasheet for NXP PTN3460BS/F2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.