Frequency40MHz
PackageLQFP
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Technical Specifications
NXP S9S08DV16F2MLC technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, SCI, LIN
Max Frequency
40MHz
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Supply Voltage
5.5V
Memory Size
16KB
Memory Type
FLASH,
Min Supply Voltage
2.7V
Number of ADC Channels
10
Number of I/Os
25
Oscillator Type
External
Package Quantity
1250
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
RAM Size
1KB
Series
S08
Weight
0.006653oz
Compliance
RoHS
Compliant
Datasheet
NXP S9S08DV16F2MLC Datasheet
Download the complete datasheet for NXP S9S08DV16F2MLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.