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Technical Specifications
NXP S9S08DV32F2MLCR technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | S08 |
| Interface | I2C, SPI, CAN, LIN, SCI |
| Max Operating Temperature | 125°C |
| Memory Size | 32KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 25 |
| Oscillator Type | External |
| Packaging | Tape and Reel |
| Peripherals | POR, PWM, WDT, LVD |
| Series | S08 |
Compliance
| RoHS | Compliant |
Datasheet
NXP S9S08DV32F2MLCR Datasheet
Download the complete datasheet for NXP S9S08DV32F2MLCR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.