Quick Jump:
Technical Specifications
NXP S9S08DZ60F2MLF technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Frequency
40MHz
Interface
I2C, SPI, CAN, LIN, SCI
Max Frequency
40MHz
Max Operating Temperature
125°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Max Supply Voltage
5.5V
Min Supply Voltage
2.7V
Mount
Surface Mount
Number of I/Os
39
Number of Timers/Counters
2
Oscillator Type
External
Package Quantity
250
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
RAM Size
4KB
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP S9S08DZ60F2MLF Datasheet
Download the complete datasheet for NXP S9S08DZ60F2MLF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
