8-bit CISC microcontroller featuring 16KB Flash program memory and 1KB RAM. This surface-mount device operates at up to 40 MHz with an S08 core architecture. It offers 22 programmable I/Os, I2C, SCI, and SPI interfaces, and 12 ADC channels. The 20-pin TSSOP package, measuring 6.6mm x 4.5mm, is suitable for automotive applications and operates from -40°C to 85°C.
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NXP S9S08EL16F1CTJ technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.6(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 0.0814 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BBC |
| Family Name | S08 |
| Data Bus Width | 8bit |
| Instruction Set Architecture | CISC |
| Maximum Clock Rate | 40MHz |
| Maximum CPU Frequency | 40MHz |
| Device Core | S08 |
| Program Memory Type | Flash |
| Program Memory Size | 16KB |
| RAM Size | 1KB |
| Number of Programmable I/Os | 22 |
| Core Architecture | S08 |
| Programmability | Yes |
| Interface Type | I2C/SCI/SPI |
| CAN | 0 |
| I2C | 1 |
| SPI | 1 |
| Ethernet | 0 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| ADC Channels | 12 |
| Number of ADCs | Single |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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