8-bit CISC microcontroller featuring a 40 MHz S08 core with 16KB Flash program memory and 512B RAM. This surface-mount device offers 16 programmable I/Os, two timers, and I2C/SCI/SPI interfaces. It operates from 3.3V to 5.5V, with a temperature range of -40°C to 85°C, and includes 12 ADC channels. Packaged in a 20-pin TSSOP (Thin Shrink Small Outline Package) with a 0.65mm pin pitch.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP S9S08EL16F1CTJR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.6(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Weight (g)
0.0814
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BCD
Family Name
S08
Data Bus Width
8bit
Instruction Set Architecture
CISC
Maximum Clock Rate
40MHz
Maximum CPU Frequency
40MHz
Device Core
S08
Program Memory Type
Flash
Program Memory Size
16KB
RAM Size
512B
Number of Programmable I/Os
16
Core Architecture
S08
Programmability
Yes
Number of Timers
2
Interface Type
I2C/SCI/SPI
CAN
0
I2C
1
SPI
1
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
12
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP S9S08EL16F1CTJR Datasheet
Download the complete datasheet for NXP S9S08EL16F1CTJR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.