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Technical Specifications
NXP S9S12GN16F1CLC technical specifications.
General
Package/Case
QFP
Core Architecture
HCS12
Data Bus Width
16b
Halogen Free
Halogen Free
Interface
SPI, SCI, IrDA, LIN, CAN
Max Frequency
25MHz
Max Operating Temperature
85°C
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
26
Number of Programmable I/O
26
Number of Timers/Counters
1
Operating Supply Voltage
5.5V
Oscillator Type
Internal
Package Quantity
250
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
RAM Size
1KB
RoHS Compliant
Yes
Series
HCS12
Weight
0.006653oz
Compliance
RoHS
Compliant
Datasheet
NXP S9S12GN16F1CLC Datasheet
Download the complete datasheet for NXP S9S12GN16F1CLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.