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Technical Specifications
NXP SA5211D/01,112 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.75(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Type
Transimpedance Amplifier
Number of Elements per Chip
4
Number of Channels per Chip
1
Minimum PSRR
23dB
Output Type
Differential
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SA5211D/01,112 Datasheet
Download the complete datasheet for NXP SA5211D/01,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.