Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the NXP SA5223D,112 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 5(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.45(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AA |
| Type | Transimpedance Amplifier |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 1 |
| Minimum PSRR | 55(Typ)dB |
| Output Type | Differential |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP SA5223D,112 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
