Quick Jump:
Technical Specifications
NXP SA5223D,112 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
5(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.45(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AA
Type
Transimpedance Amplifier
Number of Elements per Chip
1
Number of Channels per Chip
1
Minimum PSRR
55(Typ)dB
Output Type
Differential
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SA5223D,112 Datasheet
Download the complete datasheet for NXP SA5223D,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.