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Technical Specifications
NXP SAA7160ET/V2/R5 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
88
PCB
88
Package Length (mm)
7.1(Max)
Package Width (mm)
7.1(Max)
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-195
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SAA7160ET/V2/R5 Datasheet
Download the complete datasheet for NXP SAA7160ET/V2/R5 to view detailed technical specifications.
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