32-bit ARM7TDMI-S RISC microcontroller featuring 1MB Flash program memory and 48KB RAM. Operates at a maximum clock rate of 50 MHz with a 32-bit data bus width. Offers 144 programmable I/Os and interfaces including 4 CAN, 1 I2C, and 2 SPI. Packaged in a 208-pin MAP-BGA (17x17x1.3mm) for surface mounting, with an operating temperature range of -40°C to 105°C and a supply voltage of 2.75V to 5.5V.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP SAC7136J0VVF50 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 208 |
| PCB | 208 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.3(Max) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-151-AAF-1 |
| Family Name | MAC7xxx |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 50MHz |
| Maximum CPU Frequency | 50MHz |
| Device Core | ARM7TDMI-S |
| Program Memory Type | Flash |
| Program Memory Size | 1MB |
| RAM Size | 48KB |
| Number of Programmable I/Os | 144 |
| Core Architecture | ARM |
| Programmability | Yes |
| Number of Timers | 1 |
| Interface Type | CAN/I2C/SCI/SPI |
| CAN | 4 |
| I2C | 1 |
| SPI | 2 |
| Ethernet | 0 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 2.75|5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP SAC7136J0VVF50 Datasheet
Download the complete datasheet for NXP SAC7136J0VVF50 to view detailed technical specifications.
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