PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP SAF1508BET/V1,118 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
36
PCB
36
Package Length (mm)
3.6(Max)
Package Width (mm)
3.6(Max)
Package Height (mm)
0.9(Max)
Seated Plane Height (mm)
1.15(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Interface Type
UART
USB Speed Type
Low Speed|Full Speed|High Speed
USB Transceiver
No
Protocols Supported
USB 2.0
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SAF1508BET/V1,118 Datasheet
Download the complete datasheet for NXP SAF1508BET/V1,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.