Dual-channel UART with 128-byte transmit and receive FIFOs, supporting RS-485 standard. Features a maximum data rate of 5Mbps and operates from a 1.65V to 1.95V supply, with a typical voltage of 1.8V. This surface-mount integrated circuit is housed in a 36-pin TFBGA package measuring 3.6mm x 3.6mm x 0.9mm with a 0.5mm pin pitch. Operating temperature range is -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP SC16C852LIET,157 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
36
PCB
36
Package Length (mm)
3.6(Max)
Package Width (mm)
3.6(Max)
Package Height (mm)
0.9(Max)
Seated Plane Height (mm)
1.15(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Receive FIFO
128byte
Number of Channels per Chip
2
Transmit FIFO
128byte
Maximum Data Rate
5Mbps
Transmitter and Receiver FIFO Counter
Yes
Standard Supported
RS-485
Max Operating Supply Voltage
1.95V
Min Operating Supply Voltage
1.65V
Maximum Supply Current
2mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
1.8V
Maximum Power Dissipation
500mW
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SC16C852LIET,157 Datasheet
Download the complete datasheet for NXP SC16C852LIET,157 to view detailed technical specifications.
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