Dual-channel UART with 128-byte transmit and receive FIFOs, supporting RS-485 standard. Features a maximum data rate of 5Mbps and operates from a 1.65V to 1.95V supply, with a typical voltage of 1.8V. This surface-mount integrated circuit is housed in a 36-pin TFBGA package measuring 3.6mm x 3.6mm x 0.9mm with a 0.5mm pin pitch. Operating temperature range is -40°C to 85°C.
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NXP SC16C852LIET,157 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 36 |
| PCB | 36 |
| Package Length (mm) | 3.6(Max) |
| Package Width (mm) | 3.6(Max) |
| Package Height (mm) | 0.9(Max) |
| Seated Plane Height (mm) | 1.15(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Receive FIFO | 128byte |
| Number of Channels per Chip | 2 |
| Transmit FIFO | 128byte |
| Maximum Data Rate | 5Mbps |
| Transmitter and Receiver FIFO Counter | Yes |
| Standard Supported | RS-485 |
| Max Operating Supply Voltage | 1.95V |
| Min Operating Supply Voltage | 1.65V |
| Maximum Supply Current | 2mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Typical Operating Supply Voltage | 1.8V |
| Maximum Power Dissipation | 500mW |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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