PackageDIP
MountingThrough Hole
Power600uW
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Technical Specifications
NXP SE555N technical specifications.
General
| Package/Case | DIP |
| Lead Free | Lead Free |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Max Supply Voltage | 18V |
| Min Supply Voltage | 4.5V |
| Mount | Through Hole |
| Operating Supply Voltage | 15V |
| Packaging | Rail/Tube |
| Power Dissipation | 600uW |
| Reach SVHC Compliant | No |
| RoHS Compliant | No |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP SE555N Datasheet
Download the complete datasheet for NXP SE555N to view detailed technical specifications.
No datasheet is available for this part.
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