Frequency132MHz
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP SPC5553MVZ132 technical specifications.
General
Package/Case
BGA
Core Architecture
PowerPC
Data Bus Width
32b
Frequency
132MHz
Halogen Free
Halogen Free
Interface
SPI, CAN, Ethernet, SCI, EBI/EMI
Max Frequency
132MHz
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Supply Voltage
5.25V
Memory Size
1.5KB
Memory Type
FLASH,
Min Supply Voltage
1.35V
Mount
Surface Mount
Number of I/Os
220
Number of Timers/Counters
56
Oscillator Type
External
Package Quantity
300
Packaging
Tray
Peripherals
POR, PWM, WDT, DMA
RAM Size
64KB
RoHS Compliant
Yes
Series
MPC55xx Qorivva
Compliance
RoHS
Compliant
Datasheet
NXP SPC5553MVZ132 Datasheet
Download the complete datasheet for NXP SPC5553MVZ132 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.