32-bit RISC microcontroller featuring an e200z7d core, operating at up to 150 MHz. 1MB Flash program memory and 256KB RAM. 473-pin MAP-BGA package with 0.8mm pitch, suitable for surface mounting. Supports CAN (4), Ethernet (1), I2C (2), and SPI (2) interfaces. Operates from 3.3V/5V with a temperature range of -40°C to 125°C. Includes 34 ADC channels and 5 timers.
PackageMAP-BGA
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP SPC5673KFF0MMS1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
473
PCB
473
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.18
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Weight (g)
1.6233
Package Material
Plastic
Mounting
Surface Mount
Family Name
MPC56xx
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
150MHz
Maximum CPU Frequency
150MHz
Device Core
e200z7d
Program Memory Type
Flash
Program Memory Size
1MB
RAM Size
256KB
Number of Programmable I/Os
16
Core Architecture
e200
Programmability
Yes
Number of Timers
5
Interface Type
CAN/Ethernet/I2C/SCI/SPI
CAN
4
I2C
2
SPI
2
Ethernet
1
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
3.6|5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
ADC Channels
34/34/34/34
Number of ADCs
Quad
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SPC5673KFF0MMS1 Datasheet
Download the complete datasheet for NXP SPC5673KFF0MMS1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.