32-bit RISC microcontroller featuring an e200z7d core, operating at up to 180 MHz. This MCU offers 2MB of Flash program memory and 512KB of RAM. It supports automotive applications with a 257-pin MAP-BGA surface mount package (14x14mm, 0.8mm pitch). Connectivity includes 4 CAN, 3 I2C, 3 SPI, and 1 Ethernet interface, alongside quad ADCs. Operating voltage ranges from 3.3V to 5.5V, with an extended temperature range of -40°C to 125°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP SPC5675KFF0MMM2R technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
257
PCB
257
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1.17(Max)
Seated Plane Height (mm)
1.51(Max)
Pin Pitch (mm)
0.8
Package Weight (g)
0.4072
Package Material
Plastic
Mounting
Surface Mount
Family Name
MPC56xx
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
180MHz
Maximum CPU Frequency
180MHz
Device Core
e200z7d
Program Memory Type
Flash
Program Memory Size
2MB
RAM Size
512KB
Number of Programmable I/Os
16
Core Architecture
e200
Programmability
Yes
Number of Timers
5
Interface Type
CAN/Ethernet/I2C/SCI/SPI
CAN
4
I2C
3
SPI
3
Ethernet
1
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
3.6|5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
ADC Channels
22/22/22/22
Number of ADCs
Quad
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SPC5675KFF0MMM2R Datasheet
Download the complete datasheet for NXP SPC5675KFF0MMM2R to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.