The DIP Flyback IC is a single-output device with a maximum supply current of 1.9mA and a power dissipation of 1.7W. It is designed for operation over a temperature range of -20°C to 85°C and is compliant with RoHS regulations. The IC is packaged in a DIP package and is available in quantities of 1000. It is suitable for use in through-hole mounting applications and is lead-free.
PackageDIP
MountingThrough Hole
Power1.7W
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Technical Specifications
NXP SSL1623PH/N1,112 technical specifications.
General
| Package/Case | DIP |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -20°C |
| Max Supply Current | 1.9mA |
| Mount | Through Hole |
| Number of Outputs | 1 |
| Package Quantity | 1000 |
| Packaging | Rail/Tube |
| Power Dissipation | 1.7W |
| RoHS Compliant | Yes |
| Topology | Flyback |
Compliance
| RoHS | Compliant |
Datasheet
NXP SSL1623PH/N1,112 Datasheet
Download the complete datasheet for NXP SSL1623PH/N1,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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