PackageLFBGA
MountingSurface Mount
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Technical Specifications
NXP SSTUH32864EC,557 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
96
PCB
96
Package Length (mm)
13.6(Max)
Package Width (mm)
5.6(Max)
Package Height (mm)
1.2(Max)
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SSTUH32864EC,557 Datasheet
Download the complete datasheet for NXP SSTUH32864EC,557 to view detailed technical specifications.
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