PackageSO
MountingSurface Mount
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Technical Specifications
NXP TDA1308T/N2/N,115 technical specifications.
General
Package/Case
SO
Pin Count
8
PCB
8
Package Length (mm)
5(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.45(Max)
Mounting
Surface Mount
Function
Headphone
Amplifier Type
Class-AB
Typical PSRR
90dB
Input Signal Type
Differential
Output Signal Type
Single
Output Type
2-Channel Stereo
Maximum Input Bias Current
0.00001(Typ)@5VuA
Maximum Input Offset Voltage
10(Typ)mV
Maximum Output Current
60(Typ)mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA1308T/N2/N,115 Datasheet
Download the complete datasheet for NXP TDA1308T/N2/N,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.