PackageSIL9MPF
MountingThrough Hole
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Technical Specifications
NXP TDA1519/N2,112 technical specifications.
General
Package Family Name
SIL9MPF
Package/Case
SIL9MPF
Pin Count
9
PCB
9
Tab
Tab
Package Length (mm)
21.8(Max)
Package Width (mm)
3.7(Max)
Package Height (mm)
6.48(Max)
Seated Plane Height (mm)
18.5(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Function
Speaker
Amplifier Type
Class-B
Input Signal Type
Differential
Output Signal Type
Single
Output Type
2-Channel Stereo
Maximum Output Current
4000mA
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA1519/N2,112 Datasheet
Download the complete datasheet for NXP TDA1519/N2,112 to view detailed technical specifications.
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