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Technical Specifications
NXP TDA18252HN/C1/S3,5 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 7.1(Max) |
| Package Width (mm) | 7.1(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-243VKKD |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA18252HN/C1/S3,5 Datasheet
Download the complete datasheet for NXP TDA18252HN/C1/S3,5 to view detailed technical specifications.
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