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Technical Specifications
NXP TDA18272HN/S/C1:55 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Function
TV
Minimum Frequency
42MHz
Maximum Frequency
870MHz
Typical Operating Supply Voltage
3.3V
Typical Noise Figure
5dB
Min Operating Temperature
-20°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA18272HN/S/C1:55 Datasheet
Download the complete datasheet for NXP TDA18272HN/S/C1:55 to view detailed technical specifications.
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