The TDA3608TH/N3,518 is a specialized regulator IC from NXP, packaged in a 20-pin HSOP with a lead-frame SMT construction. It features a heat-sinked small outline package with a maximum seated plane height of 3.5mm. The IC is designed for surface mount applications with a pin pitch of 1.27mm and a maximum package length and width of 16mm and 11.1mm, respectively. The package material is plastic, and the IC is suitable for use in a variety of applications requiring specialized regulation.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | HSOP |
| Package/Case | HSOP |
| Package Description | Heat Sinked Small Outline Package |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 16(Max) |
| Package Width (mm) | 11.1(Max) |
| Package Height (mm) | 3.5(Max) |
| Seated Plane Height (mm) | 3.5(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP TDA3608TH/N3,518 to view detailed technical specifications.
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