PackageDBSP
MountingThrough Hole
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Technical Specifications
NXP TDA3681J/N2C,112 technical specifications.
General
Package Family Name
DBSP
Package/Case
DBSP
Pin Count
17
PCB
17
Package Length (mm)
24(Max)
Package Width (mm)
4.6(Max)
Package Height (mm)
12.2(Max)
Mounting
Through Hole
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA3681J/N2C,112 Datasheet
Download the complete datasheet for NXP TDA3681J/N2C,112 to view detailed technical specifications.
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