The TDA6500TT/C4 is a 32-pin lead-frame SMT package, housed in a thin shrink small outline package with a gull-wing lead shape. It has a maximum package length of 11.1mm, width of 6.2mm, and height of 0.95mm, and is made of plastic. The IC is designed for surface mount applications and conforms to the JEDEC MO-153DC standard.
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NXP TDA6500TT/C4 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 11.1(Max) |
| Package Width (mm) | 6.2(Max) |
| Package Height (mm) | 0.95(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153DC |
| Cage Code | H1R01 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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